| PART |
Description |
Maker |
| AWSCR-10.01MHZCE-C10-T |
CERAMIC RESONATOR, 10.01 MHz ROHS COMPLIANT, CERAMIC PACKAGE-3
|
Abracon, Corp.
|
| AWSCR-16.01MHZCV-C10-T |
CERAMIC RESONATOR, 16.01 MHz ROHS COMPLIANT, CERAMIC PACKAGE-3
|
Abracon, Corp.
|
| SA57031-XX SA57031-25 SA57031-26 SA57031-31 SA5703 |
Micropower 150 mA, low-noise, low dropout linear regulator with on/off 微功耗为150 mA，低噪声，低压差线性稳压器的开/
RECTIFIER BRIDGE 25A 800V 300A-ifsm 1.1V-vf 5uA-ir GBPCW 100/TRAY
CAP CERAMIC MONO .1UF 50V 10%
Ceramic Multilayer Capacitor; Capacitance:22pF; Capacitance Tolerance: /- 5 %; Working Voltage, DC:50V; Dielectric Characteristic:C0G/NP0; Package/Case:0603; Series:VJ; Leaded Process Compatible:Yes; Mounting Type:Surface Mount
Ceramic Multilayer Capacitor; Capacitor Type:General Purpose; Capacitance:1.2pF; Capacitance Tolerance: 0.5pF; Voltage Rating:50VDC; Capacitor Dielectric Material:Multilayer Ceramic; Package/Case:0603; Termination:SMD RoHS Compliant: Yes
Ceramic Multilayer Capacitor; Capacitance:1.5pF; Capacitance Tolerance: /- 0.5 pF; Working Voltage, DC:50V; Dielectric Characteristic:C0G/NP0; Package/Case:0603; Series:VJ; Features:Multilayer Ceramic Chip Capacitor
Ceramic Multilayer Capacitor; Capacitance:1pF; Capacitance Tolerance: /- 0.5 pF; Working Voltage, DC:50V; Dielectric Characteristic:C0G/NP0; Package/Case:0603; Series:VJ; Features:Multilayer Ceramic Chip Capacitor
|
TE Connectivity, Ltd.
NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
|
| CSTCE20M0V53-R0 |
CERAMIC RESONATOR, 20 MHz CERAMIC PACKAGE-3
|
Murata Manufacturing Co., Ltd.
|
| HWZT-12.50RS HWZT-4.00RS HWZT-12.50RS-A HWZT-4.00R |
CERAMIC RESONATOR, 12.5 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 4 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
|
Abracon, Corp.
|
| 555-0402 555-0402-5N6-G-00 555-0402-3N3-G-36 555-0 |
1 ELEMENT, 0.011 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0075 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0051 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.036 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0039 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Chip inductors, wire wound, surface mount, 0402 package
|
WEARNES CAMBION LTD
CAMBION Electronic Components
|
| DB03008810KVP2000PF/-20R230 DB03008810KVP2000PF/-1 |
1 FUNCTIONS, 10000 V, 30 A, FEED THROUGH CAPACITOR CERAMIC PACKAGE-2
1 FUNCTIONS, 8000 V, 30 A, FEED THROUGH CAPACITOR CERAMIC PACKAGE-2
|
Vishay Beyschlag
VISHAY DRALORIC
|
| 2N918ACSM 2N918ACSM.MODG4 |
Si, NPN, RF SMALL SIGNAL TRANSISTOR HERMETIC SEALED, CERAMIC, LCC1, 3 PIN
Bipolar NPN Device in a Hermetically sealed LCC1 Ceramic Surface Mount Package for High Reliability Applications
|
TT electronics Semelab, Ltd.
SEME-LAB[Seme LAB]
|
| SA110A SA11A SA13ARL SA43ARL SA33ARL SA24ARL SA14A |
500 Watt Peak Power MiniMOSORB™ Zener Transient Voltage Suppressors
500 Watt Peak PowerMiniMOSORB Zener Transient Voltage Suppressors
500 W Peak Power MiniMOSORB Zener Transient Voltage Suppressor Unidirectional
500 Watt Peak Power MiniMOSORB Zener Transient Voltage Suppressors
STANDOFF,M-F,1/4H,4-40X.25SS
Ceramic Multilayer Capacitor; Capacitor Type:General Purpose; Capacitance:3300pF; Capacitance Tolerance: 10%; Voltage Rating:50VDC; Capacitor Dielectric Material:Multilayer Ceramic; Package/Case:1206; Termination:SMD RoHS Compliant: Yes
Ceramic Multilayer Capacitor; Capacitance:1000pF; Capacitance Tolerance: /- 10 %; Working Voltage, DC:25V; Dielectric Characteristic:X7R; Package/Case:1206; Series:VJ; Features:Multilayer Ceramic Chip Capacitor
Ceramic Multilayer Capacitor; Capacitor Type:General Purpose; Capacitance:0.01uF; Capacitance Tolerance: 5%; Voltage Rating:25VDC; Capacitor Dielectric Material:Multilayer Ceramic; Package/Case:0805; Termination:SMD RoHS Compliant: Yes
|
On Semiconductor
|
| ILCX05-BB0318-20.000 ILCX05-BB1318-20.000 ILCX05-B |
4 Pad Ceramic Package, 5.5 mm x 11.9 mm
|
ILSI America LLC
|
| HSEB1 HXXDC1 HXXDC3 HXXAB1 HXXAB3 HXXAA1 HXXAA3 HS |
6.0mm x 3.5 mm x1.2mm Ceramic Package
|
MMD Components
|
| T570N |
Hermeticaly sealed ceramic package
|
Infineon Technologies A...
|
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